中文摘要：

为了更好地解决大功率LED散热问题,促进其集成化,提出了一种基于合成双射流（DSJ）与翅片主-被动组合的散热方式。通过实验对比,分析了4种不同方式的散热特性。结果表明,采用DSJ单独散热,芯片温度会迅速下降并趋于稳定;采用DSJ与翅片主-被动组合结构,芯片稳定温度相对于商用翅片下降了15℃,不仅散热效果显著,而且结构紧凑。

英文摘要：

In order to better solve the heat dissipation of high-power light-emitting diode （LED） and facilitate its integration,an active and passive combination method is proposed based on dual synthetic jets and a fin. The comparative analysis of four different heat dissipation methods is executed on their heat dissipation characteristics. The heat dissipation characteristics of dual synthetic jets （DSJs） are investigated on different LED powers and jet-to-surface distances,and compared with those of the commercial LED product. The results indicate that the chip temperature rapidly decreases and tends to be stable using DSJ single cooling, but the stable temperature is about 9.8 ℃ higher than that using the commercial fin. However, the heat dissipation effect is significantly enhanced and the stable temperature further drops 15 ℃ using the combination structure with respect to the commercial fin. The effects of jet-to-surface distance on the heat dissipation performance of DSJ are roughly consistent, and an optimal cooling effect is achieved when the jet-to-surface distance is about 20 mm for LED array chips with different powers. In addition, the effect of jet-to-surface distance on the combination structure is complicated but not remarkable. The stable temperatures decrease within 14. 4 ℃ -24.4℃ using the combination structure at different i evto-surface distances compared with the commercial LED product,which demonstrates that the combination structure not only can enhance the heat dissipation effect for the LED array chips, but also make the installation more flexible, thus to effectively reduce the installation space of the heat dissipation structure.