中文摘要：

利用铜离子的抑菌功能,研究了含铜CoCrMo钴基合金的抗菌特性。结果表明,含铜CoCrMo合金具有良好的广谱抗菌性能,对大肠杆菌和金黄色葡萄球菌的杀灭率均在95.7%以上。通过对不同浓度的大肠杆菌的抗菌性能研究表明,含铜CoCrMo合金对1×10^6cfu/m L以下浓度的大肠杆菌均表现出良好的抗菌性能,随着细菌浓度的升高,抗菌性能迅速下降。对细菌生物膜的观察结果表明,含铜CoCrMo合金可以有效地抑制细菌生物膜的形成,减少表面细菌粘附的数量。电化学试验结果表明,含铜CoCrMo合金与大肠杆菌作用后,Cu离子溶出加快,表现出合金的自腐蚀电位和点蚀电位有所降低。

英文摘要：

The antibacterial performance of a Cu-bearing CoCrMo alloy was studied by use of antibacterial function of copper（Cu） ions. Results show that the Cu-bearing CoCrMo alloy has broad-spectrum antibacterial features, and the antibacterial rates against both E. coli and S. aureus selected in the present work all reach above 95.7%. Through studies of different concentration of E. coli on antibacterial rate of Cu-bearing CoCrMo alloy, it is proved that the alloy has good antibacterial performance against E. coli below 1×10^6 cfu/ml, and with increase of the concentration of E. coli, the antibacterial performance drops quickly. The bacterial biofilm observation indicates that Cu-bearing CoCrMo alloy could effectively reduce the number of bacteria on the surface, and then inhibit the formation of the biofilm. The electrochemical experiment reveals that after contacting with E. coli, the release of Cu irons from Cu-bearing CoCrMo alloy becomes faster, resulting in certain decreases of the self corrosion potential and pitting potential of the alloy.