中文摘要：

研究了SiCp/A356复合材料非真空半固态搅拌钎焊过程。在一定的搅拌钎焊条件下,重点研究了钎料的固相率对接头的微观结构、线结合率和强度的影响规律。研究结果表明：在搅拌条件下,半固态钎料固相率对基体氧化膜的破碎有重要影响;随着钎料固相率的增加,接头界面的线结合率和接头的强度先增加后减小;在钎料固相率为60%时,接头界面线结合率和接头强度同时达到最大值,分别为91.2%和160MPa。

英文摘要：

The vacuum-free semi-solid stirring brazing process of SiCp/A356 composites was investigated.Under a certain stirring and brazing condition,the effects of the solid fraction in filler metal on the microstructure,bonded ratio and the tensile strength of bonded joints were investigated.Results show that with stirring the solid fraction of the semi-solid filler metal has a significant influence on the break of the substrate oxide film.And,with increasing of the solid fraction in filler metal,the bonded ratio of the interface and the tensile strength of the bonded joints increases,until up to the maximum values of 91.2% and 160 MPa respectively when the solid fraction is 60%;afterwards they start to decrease.At that time,a good bond between filler metal and composites appears.