中文摘要：

本文建立了SiCp/Al复合材料的二维实体模型,基于压痕断裂力学的方法,研究了压痕深度的变化对SiCp/Al复合材料磨削加工去除机理的影响。结果表明：随着压痕深度的增加,压头下方SiC颗粒的第一主应力逐渐变大,Al基体的von Mises等效应力也逐渐变大。当压痕深度大于等于0.15μm时,压头下方会形成塑形变形区;压痕深度大于等于0.292μm时,SiC颗粒会由于拉应力的作用而产生径向裂纹;当压痕深度超过0.34μm时,Al基体由于局部被压溃而影响SiCp/Al复合材料延性去除机理。

英文摘要：

In this paper,a solid two-dimensional model of SiCp/Al composites was built.Based on the method of indentation fracture mechanics,the effect of different indentation depth on removal mechanism during grinding of SiCp/Al composites was investigated.The results indicate that the first principal stress of SiC particle beneath the indenter,as well as von Mises equivalent stress of Al matrix,increases with the indentation depth increasing.There is a plastic deformation region under the indenter when the indentation depth is no less than 0.15 μm,and tensile stress can result in lateral cracking of SiC particle when the indentation depth is larger than 0.292 μm.Local crash of Al matrix may influence the ductile removal mechanism of SiCp/Al composites when the indentation depth exceeds 0.34 μm.