采用X射线光电子能谱(XPS)研究了高压直流电极化前后真空蒸发沉积的金属Ag电极与聚合物PVDF薄膜间的相互作用。高分辨率的Ag3p、C1s和F1s的XPS能谱分析表明:电极化前,由于蒸发Ag电极的凝聚能及HF的挥发,在Ag/PVDF界面处产生了新的C=C;高温高压电极化后,由于极化过程中注入的负电荷及Ag的扩散,Ag/PVDF薄膜界面处因蒸发能量形成的F-C基,与Ag之间形成F-C-Ag有机化合物。电极化不仅改善了PVDF薄膜的压电性,还通过界面化学键合作用提高了聚合物薄膜与金属电极间的粘附性。
The interaction between argentum electrode deposited by evaporation and poly (vinylidene fluoride) (PVDF) thin film has been studied before and after electric poling by the aid of X-ray photoelectron spectroscopy (XPS). Analyses of high-resolution Ag3p, C1s and F1s spectra reveal the formation of new C=C bond at the interface of untreated Ag/PVDF for the evaporation energy of Ag and volatilization of HF in the process. With the effect of high electric field at high temperature, the F-C-Ag organoeomplex is created through the action of Ag and C-F groups which produced by the evaporation energy, because of the injection of negative charge and diffusion of argentum. The results indicate that the piezoelectricity of PVDF thin films and adhesion between polymer thin film and metal electrode are improved by electric poling and chemical bond joint, respectively.