针对柔性热电薄膜器件的最新研究进展,从柔性基底、热电材料、薄膜沉积工艺、过渡层的引入和器件设计等几个方面归纳总结了在热电器件制作过程中材料和工艺选择方面应注意的问题.对各类柔性热电薄膜器件的性能对比分析表明:目前性能最佳的柔性器件采用的材料是(Bi,Sb)2Te3类合金,其单个热电偶对在1K的温差下可输出0.1~0.3 mV的电压;在内阻足够低的条件下,单个热电偶对在1K温差下的输出电压与热电材料的Seebeck系数相等;增加热电薄膜的厚度能够有效地降低热电偶对的内阻,进而提高器件的输出电压.
The recent research progress of flexible thin-film thermoelectric devices is presented from the following aspects:the choice of the flexible substrates,the types of thermoelectric materials,the deposition process of thermoelectric thin films,the introduction of buffer layer,and the design of devices.At the same time,the major aspects in selection of thermoelectric materials and deposition process of thin films have been summarized.By comparison among the performances of reported thermoelectric devices,the flexible thin-film thermoelectric devices with alloy of (Bi,Sb)2 Te3 show the best performance and the output voltage of single thermocouple can reach 0.1-0.3 mV with the temperature difference of 1 K,which nearly equals to the Seebeck coefficient of thermoelectric materials on the condition of sufficiently low internal resistance.Increasing the thickness of thermoelectric thin film can reduce the internal resistance of thermocouple effectively,and therefore improve the output voltage of flexible thin-film thermoelectric devices.