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甲磺酸体系电沉积法制备电沉积铜用新型铅合金阳极材料性能研究
  • ISSN号:1005-023X
  • 期刊名称:材料导报
  • 时间:2013.5.5
  • 页码:36-39
  • 分类:TG146.12[金属学及工艺—金属材料;一般工业技术—材料科学与工程;金属学及工艺—金属学]
  • 作者机构:[1]昆明理工大学冶金与能源学院,昆明650093, [2]昆明理工恒达科技有限公司,昆明650106
  • 相关基金:国家自然科学基金(51004056);云南省应用基础研究基金(2010ZC052)
  • 相关项目:锌电积用二氧化铅颗粒增强铅基合金复合材料制备及电化学性能研究
中文摘要:

通过电化学方法研究甲基磺酸体系中电沉积得到的纯Pb、Pb-Sn(0.6%)和Pb-Sn(0.6%)-Sb(0.6%)(均为质量分数)合金阳极在CuSO4-H2SO4体系下的电化学性能,结果表明新型的Pb-Sn(0.6%)-Sb(0.6%)合金阳极电催化性能和耐蚀性能均比Pb-Sn(0.6%)和纯Pb阳极优异.采用扫描电子显微镜观察了3种合金材料极化24 h后的表面形貌,图像显示纯Pb表面疏松多孔,大部分区域出现了裂纹,Pb-Sn(0.6%)和Pb-Sn(0.6%)-Sb(0.6%)合金阳极表面形貌比较均匀和致密.X射线衍射表明,Pb-Sn(0.6%)和Pb-Sn(0.6%)-Sb(0.6%)合金材料对应的PbO2和PbO的衍射峰比纯Pb强,且Pb-Sn(0.6%)-Sb(0.6%)阳极材料PbO2的衍射峰最强,说明Pb-Sn(0.6%)-Sb(0.6%)阳极的导电性最好.

英文摘要:

YUAN Feigang, CHEN Buming, GUO Zhongcheng, LIU Jianhua, ZHOU Songbing (1 Faculty of Metallurgical and Energy Engineering, Kunming University of Science and Technology, Kunming 650093; 2 Kunming Hendera Science and Technology Co. Ltd. , Kunming 650106) Abstract The performances of the pure Pb, Pb-Sn(0. 6%) and Pb-Sn(0. 6%)-Sb(0. 60%) (all in mass frac- tion) in CuSO4-H2 SO4 system were analyzed with the electrochemical experiments. The results indicated that the electrocatalytic activity and corrosion resistance of the Pb-Sn(0. 6%)-Sb(0. 6%) anode was the best among the three an- ode materials. The structure of the three electrode materials were studied by scanning electron microscope after 24 h anodic polarization, which showed that the surface of the Pb-Sn(0. 60%) and Pb-Sn(0. 6%)-Sb(0. 6%) anode materials was more uniform and compact, while the surface of the pure Pb was loose and porous, and had some cracks in most of the areas. The X-ray diffraction indicated that the diffraction peaks of PbOz and PbO formed on the Pb-Sn(0. 6%)- Sb(0. 6%) anode and Pb-Sn(0. 6%) were weaker than the pure Pb anode,while the diffraction peaks of PbO2 formed on the Pb-Sn(0.6%)-Sb(0.6 %) anode were the strongest, which showed that the conductivity of the Pb-Sn(0. 6 %)- Sb(0. 6%) anode was the best.

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期刊信息
  • 《材料导报:纳米与新材料专辑》
  • 主管单位:重庆西南信息有限公司(原科技部西南信息中心)
  • 主办单位:重庆西南信息有限公司(原科技部西南信息中心)
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  • 地址:重庆市渝北区洪湖西路18号
  • 邮编:401121
  • 邮箱:matreved@163.com
  • 电话:023-67398525
  • 国际标准刊号:ISSN:1005-023X
  • 国内统一刊号:ISSN:50-1078/TB
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  • 被引量:3397