Ni-9.3at%W 底层的微观结构和质地上的中间的退火的效果(IA ) 被使用电子 backscattering 衍射和 X 光检查衍射调查了。结果建议 IA 能优化变丑微观结构的同质。更高的 IA 温度(没有在 IA 期间经历再结晶) 将增加变丑质地的铜类型部件并且在再结晶以后改进立方体质地的内容。锋利的立方体质地(97.2%) 能在 650 的最佳 IA 温度被获得
The effects of intermediate annealing (IA) on the microstructure and texture of Ni-9.3at%W substrates have been investigated by using electron backscattering diffraction and X-ray diffraction. Results suggest that IA can optimize the homogeneity of deformation micro-structure. Higher IA temperatures (without undergoing recrystallization during IA) will increase the copper-type components of deformation texture and improve the content of cube texture after recrystallization. Sharp cube texture (97.2%) can be obtained at the optimum IA tem-perature of 650°C. The mechanism underlying the transition of deformation texture can be interpreted as that IA increases the dislocation slipping ability and suppresses the twinning deformation of Copper orientation in the subsequent rolling process. The observed strengthening of cube texture as a result of IA treatment is presumably attributed to the reduction of noncube nucleation and the optimization of preferential growth surrounding the cube nuclei.