中文摘要：

将酚醛空心微球引入热固性酚醛树脂，经模压成型、高温固化处理，合成了酚醛炭泡沫前驱体——闭孔微球型酚醛泡沫材料。采用SEM、万能试验机、热重分析仪和热常数测定仪等测试手段，对酚醛泡沫材料的微观结构、压缩性能、耐高温性能和隔热性能进行表征。结果表明，酚醛泡沫内部含有大量均匀分布的微米级闭孔结构的泡孔，其压缩断裂特征为假塑性断裂模式；引入适量的空心微球相，可有效改善酚醛泡沫的断裂韧性和比压缩强度；酚醛泡沫具有良好的热稳定性，它的起始分解温度为210℃，750℃时的残炭率为51．9％；酚醛泡沫的热导率低，隔热性能优异，空心微球质量含量为45％的酚醛泡沫，在100℃下的热导率仅为0．057W／（m·K），比同温度下纯酚醛树脂的热导率低47％。

英文摘要：

Hollow phenolic microspheres were incorporated into thermoset phenolic resin to synthesize phenolic foams precursor with closed-pore structure by mold forming and higb temperature curing. Microstructure, mechanical properties, high-temperature resistance and heat-insulating properties were characterized by SEM, universal testing machine, thermogravimetric analyzer and the mal physical properties measurement meter respectively. The results show that a large amount of closed micro-pores are distributed uniformly throughout the phenolic foam, compressive fracture characteristics of which was pseudoplastic. With adding proper content of microspheres, the fracture toughness and specific compressive strength could be improved obviously. The phenolic foam possesses good thermal stability. Its initial thermal-decomposition temperature is 210 ℃. The char yield is 51.9% at 750 ℃. The phenolic foam also exhibits good heat insulation for its low thermal conductivity, which is 0.057 W/（m · K） at 100 ℃ with 45% of micro spheres, lower than that of pure phenolic resin by as much as 47%.