位置：成果数据库 > 期刊 > 期刊详情页
Tribocorrosion Study of Copper during Chemical Mechanical Polishing in Potassium Periodate-based Sl
  • ISSN号：1023-8883
  • 期刊名称：Tribology Letters
  • 时间：2015.3.10
  • 页码：-
  • 相关项目：基于电化学的化学机械平坦化终点检测方法及实验研究
作者： Jie Cheng|Tongqing Wang|Zhimin Chai|Xinchun Lu|
同期刊论文项目
基于电化学的化学机械平坦化终点检测方法及实验研究
期刊论文 14 会议论文 2
同项目期刊论文
Effect of zone pressure on wafer bending and fluid lubrication behavior during multi-zone CMP proces
抛光垫特性及其对300mm晶圆铜化学机械抛光效果的影响研究
Chemical roles on Cu-slurry interface during copper chemical mechanical planarization
Improvement of via dishing and non-uniformity in TSV chemical mechanical planarization
Kinematic analysis of in situ measurement during chemical mechanical planarization process
300mm晶圆化学机械抛光机关键技术研究与实现
A kinematic model describing particle movement near a surface as effected by Brownian motion and el
Synergetic effect of potassium molybdate and benzotriazole on the CMP of ruthenium and copper in KIO