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Preparation of PVP coated Cu NPs and the application for low-temperature bonding
  • ISSN号：0959-9428
  • 期刊名称：Journal of Materials Chemistry
  • 时间：2011
  • 页码：15981-15986
  • 相关项目：纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
作者： Yan Jianfeng|Zou Guisheng|Hu Anming|Zhou, Y. Norman|
同期刊论文项目
纳米Ag膏及其用于高温电子封装的低温烧结连接技术与机理
期刊论文 19 会议论文 27
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