对于高速精密微电子封装操作,必须降低焊头振动。基于ADAMS多体动力学和控制系统分析与优化模块,建立了粘片机焊头机构动力学PID控制模型。通过联合仿真优化,实现了摆臂式焊头机构在满足最大扭矩和残余振动约束下运动时间最短的运动速度规划,为点位运动精密定位系统的最优控制器的设计提供了一个简单的实现途径。
For fast, accurate and precise bonding operations, the vibration of the bonding arm must be minimized. Using muhibody dynamics and control system modules of ADAMS software, the minimum motion time velocity plan of the swing-pod type bonder is analyzed using PID optimal control. The maximum torque and residue vibration constraints were considered as limiting factors. Results show that the minimum time is reduced near 1/3 using optimal control. The presented method provides a simple implement method for time minimum optimal control design for a rest-to-rest motion of a complex mechanism systems.