中文摘要：

采用电磁压制和粉末”金技术相结合的方法制备了Ag40Cu23Zn31In4Ni2银基钎料箔片,分析了电磁压制中电压参数对压坯致密度的影响以及烧结工艺参数对烧结坯密度和显微组织的影响,并对该钎料的铺展润湿性进行了讨论。结果表明随着放电电压的增加,Ag40Cu23Zn31In4Ni2银基钎料的压坯致密度呈上升逐渐变缓,最后下降的趋势,在1300 V获得最高致密度81.85%;当烧结时间一定时,在一定的烧结温度范围内,随着温度升高,烧结坯致密度提高;而烧结温度一定时,随着烧结时间增长,烧结坯致密度降低。润湿铺展性试验中发现1300 V电压下压制的压坯在650℃温度下烧结0.5 h后获得的钎料箔片,其铺展面积可达到298.5 mm2,具有良好的润湿性,能满足Ag40Cu23Zn31In4Ni2银基钎料的使用要求。该结果可为电磁压制制备无镉中温银基钎料新技术的工程应用提供理论和数据支持。

英文摘要：

The silver-based solder foil Ag40Cu23Zn31In4Ni2 was prepared by the method of electromagnetic compaction and powder metallurgy. The effect of voltage on the density of the electromagnetic compacted blank was investigated, and the influence of sintering parameters on the density and microstructure of the sintered body was investigated, while the wettability of the filler metal was studied. The results show that： with the increase of the discharge voltage, the density of the Ag40Cu23Zn3 lln4Ni2 silver-based solder compacted blank gradually increases slowly and finally decreases, and the highest density of 81.85% is in 1300V. Keeping a certain sintering time, the sintering sample density is larger at higher temperature within a certain range; keeping a certain sintering temperature, prolonging sintering time can make the density get smaller of the sintering sample. The wettability test finds that： the spreading area of the solder foil obtained under 1300V voltage and sintered at a temperature of 650℃ for 0.5 h can reach 298.5 mm：. The solder has a good wettability, which can meet the requirements of the use of Ag40Cu23Zn31In4Ni2 silver-based solder. The results can provide theoretical and data support for the engineering application of electromagnetic compaction to fabrication of cadmium-free silver-based intermediate temperature filler metal.