中文摘要：

电子设备体积功率的剧增,对设备的散热需求越来越高,散热成为了当前电子器件设计时首要考虑的问题。在充分调研的基础上,提出了一种新型的阵列射流冲击冷板用于高热流密度芯片的冷却。该冷板是一种三层盒式结构,其中间层为流体入口区,然后由层间的射流孔分别向上下两层喷射,这样冷板上下两面均可作为热扩展的均温表面。理论模拟和实验分析均验证了该冷板具有良好的散热效果。

英文摘要：

The power density of the electronic device is sharply increased, so that the cooling demand of equipment is more and more urgently. Heat dissipation has become the primary consideration when the electronic device is designed. On the basis of investigation, a new model of the jet array impingement cooling plate was presented to use for cooling the chip with high heat flux. The cooling plate was a box - type structure with three layers, the middle layer was the fluid inlet area to inject into two lay- ers respectively by the jet hole, so that both sides surface of the cooling plate could be used as average temperature surface of thermal expansion. The simulation results and experimental results both show that cooling plate has good effect of the heat dissi- pation.