针对某型PCB现场失效问题开展了失效分析,发现继电器引脚与内部结构引线处遭CL元素腐蚀而断裂。为了验证失效分析的结论,确定CL元素引入路径,并进行物料择优替代,设计了CL元素腐蚀加速试验剖面,经过6个循环周期,成功复现了现场PCB失效问题,为后续产品物料替代、设计改进等提供理论依据。
With analysis of a certain type PCB field failure, it was found that pins of the relay broke because of the CL element corrosion. To verify the above conclusion and choose the better material, the accelerated corrosion test profile was designed. After six cycles, the failure mode was reappeared successfully, which could provide references for the following work such as material selection and design optimization.