中文摘要：

采用冷拉拔方法制备了高强高导Cu—Cr合金导线，考察了合金界面结构随拉拔变形量的演变，探讨了界面结构变化与合金性能的关系．结果表明，随变形量增大，Cu和Cr相均被逐渐拉长成纤维状，且两相的晶面之间逐渐趋于（111）cu//（1lO）cr，Cu／Cr界面由非共格关系演变为共格关系，同时，通过Cu／Cr界面的互扩散增强．界面密度的增加是导致电阻率随变形量增加持续增大的主要因素．界面共格化是造成合金强度增大并趋于恒定的原因．

英文摘要：

Cu-Cr alloy is a kind of promising materials used as conductor due to its good strength and high conductivity. Heavy cold deformation could increase the strength effectively. Most of Cu and Cr phase are elongated into filaments during cold drawing. There exits plenty of Cu/Cr interface and the structure of Cu/Cr interface is thought to play an essential role in the properties of the Cu-Cr alloy. In this work, Cu Cr wires were prepared by cold drawing method. The evolution of the microstructure and the structural change of phase interface during cold drawing have been investigated and the relationship between properties and microstructure also established. The microstructure consists of Cu matrix and Cr particles before cold drawing. As the drawing strain increases, both of Cu and Cr phases evolve into filamentary structure. Some residual Cr particles are still found in the alloy even at high drawing ratio. There is a relationship of （lll）cu//（ll0）cr between Cu fibers and Cr fibers at high strain levels. The Cu/Cr interface is non-coherent before cold drawing and gradually evolves into the coherent interface at high drawing strains. The inter-solution ability of Cu and Cr elements across the Cu/Cr interface is enhanced with the increase in the drawing strain. The coherent Cu/Cr interface and the increasing of interface density should be responsible for thestrength rising to an almost constant value and the increase in electrical resistivity of Cu-Cr alloys at high strain levels.