中文摘要：

采用树脂金刚石线锯对KDP晶体进行了锯切实验,使用扫描电子显微镜对KDP晶体锯切的表面缺陷进行了分析,分析了走丝速度和工件进给速度对KDP晶体表面缺陷特征的影响。分析发现线锯锯切的晶片表面缺陷主要有呈锯齿状形态的沟槽、表面破碎、划痕、橘皮状的外观、凹坑、以及锯切表面嵌入脱落磨粒和切屑。走丝速度增大,工件进给速度降低,锯切材料的表面缺陷逐渐由以脆性破碎凹坑为主转变为以材料微切削去除留下的沟痕为主。锯丝表面脱落的金刚石磨粒在锯切过程中在锯丝压力作用下挤压嵌入或冲击加工表面造成凹坑,对材料表面和亚表面质量的损害严重。其分析结果为获得高质量的锯切表面,进一步优化工艺参数提供了实验参考依据。

英文摘要：

Based on the experiments of sawing KDP crystal by diamond wire saw, the scanning electron microscope （SEM） was employed to analyze the surface defects of sawed KDP crystal, and the influences of wire speed and ingot feed speed on surface defect features were discussed. The analysis results show that the surface defects consist of some obvious serrated form grooves, lots of brittle fracture or brittle crash, intermittent scratch marks, orange peel appearance, embedded abrasive and some pits. When wire speed increases and ingot feed speed decreases, the surface defect features change from brittle fracture pits to ductile micro-cutting microgrooves. Some abrasives form the wire saw surface can be embedded in the surface of KDP crystal to generate some relatively larger and deeper pits, which are more serious for damage of the quality of surface and subsurface. The analysis results can provides an experimental reference to further optimize the process parameters in order to obtain high-quality sawed surface.