位置：成果数据库 > 期刊 > 期刊详情页
Formation of intermetallic compounds in Mg-Ag-Al joints during diffusion bonding
  • ISSN号：0022-2461
  • 期刊名称：Journal of Materials Science
  • 时间：2014.10
  • 页码：7298-7308
  • 相关项目：用于复杂加载技术的功能梯度飞片材料的设计、薄带铸造法制备及其性能
作者： Luo, Guoqiang|Li, Leijun|Shen, Qiang|Zhang, Lianmeng|
同期刊论文项目
用于复杂加载技术的功能梯度飞片材料的设计、薄带铸造法制备及其性能
期刊论文 16 会议论文 4
同项目期刊论文
Low-temperature densification and excellent thermal properties of W-Cu thermal-management composites
Effect of holding time on microstructure and mechanical properties of diffusion-bonded Mg1/pure Ag f
添加Ni箔中间层的Mg-Al扩散焊接接头界面结构和力学性能
Microstructure and mechanical properties of Al-7075/B4C composites fabricated by plasma activated si
Preparation of Monodispersed Copper Nanoparticles by an Environmentally Friendly Chemical Reduction
Effect of 2,2′-dipyridyl on the plating rate, microstructure and performance of copper-coated tungst
Facile Fabrication and Enhanced Photocatalytic Performance of Ag/AgCl/rGO Heterostructure Photocatal
Low-temperature densification and excellent thermal properties of W–Cu thermal-management composites
Effect of plasma activated sintering parameters on microstructure and mechanical properties of Al-70
Microstructure and mechanical properties of TC4/oxygen-free copper joint with silver interlayer prep
CuNi复合中间层对Mg/Al扩散焊接接头组织及力学性能的影响
Preparation of Monodispersed Copper Nanoparticles by an Environmentally Friendly Chemical Reduction