基于柔性印刷电路板(flexible printed circuits board,FPCB)技术,通过在聚酰亚胺基底薄膜表面层压的铜箔上刻蚀微电极阵列结构制备了一种细胞电融合芯片。在低电压(≤40V)条件下实现了细胞电融合,融合效率达37%,远高于聚乙二醇(polyethylene glycol,PEG)法及传统细胞电融合方法。与传统细胞电融合系统相比,此芯片可在低电压条件下工作,具有结构简单、成本低廉、实验过程可观察、融合通量高等优点。另外,聚酰亚胺薄膜基底良好的柔软度可保证此芯片与其它分析模块(如细胞筛选分离模块)的有效集成,具备构造微全分析系统(micro total analytical system,μ-TAS)的巨大潜力。
A novel flexible cell-electrofusion chip was fabricated by using the flexible printed circuits board technology, where microelectrode array was fabricated on the copper foil laminated on the surface of a polyimide membrane. On this chip, cell electrofusion could be implemented under low voltage( 〈 40 V) condition, and its fusion efficiency(37% ) was much larger than those in traditional chemical induced fusion(1‰) and electrofusion(5% ). Compared with traditional electrofusion method, this chip has many advantages such as low power supply, simple structure, cheap, convenient for observation, and high-throughput. Furthermore, the flexibility of the polyimide membrane is benefit to its integration with other modules ( e. g. cell sorting module) to form a micro total analytical system(μ-TAS).