采用活化钼-锰路线,使用72Ag28Cu(质量分数,下同)钎焊制备了高纯Al2O3陶瓷/不锈钢接头。利用SEM对金属化陶瓷的显微结构、元素分布进行了分析,并讨论活化钼-锰法的金属化机理。考察了金属化工艺、镀镍及镀后热处理对接头剪切强度和钎焊效果的影响。结果表明:玻璃相迁移和化学反应对活化Mo-Mn金属化起主要作用,金属化层烧结起辅助作用,且玻璃相迁移主要为由金属化层向陶瓷体方向。在最优工艺条件下,接头最大剪切强度达115 MPa,平均强度高于97MPa。薄的镀镍层有助于焊料浸湿金属化层和阻止焊料腐蚀金属化层。镀后热处理也可显著提高接头强度。
High purity alumina/stainless steel joints were produced by activated molybdenum -manganese route using 72Ag28Cu solder. The microstructure and elemental distribution of metallized ceramic were analyzed, and the mechanism of metallization was discussed. Influences of the metallizing technologic conditions, Ni plating and subsequent annealing on the joint shear strength were investigated. The results show that both glassy phases migration and chemical reaction act the key roles for activated Mo-Mn metallizing, but sintering of the metallized layer acts the secondary role, and the main direction of glass migration is from the metallzed layer to the ceramic matrix. The maximum of the joint shear strength under the optimized conditions reaches 115 MPa, and the average strength is over 97 MPa. A thin Ni coating will prevent the metallized layer from being wetted by the solder in resulting avoiding the erosion of the layer by the solder. The annealing after plating could improve markedly the strength of the ioints.