中文摘要：

为了对硅通孔（TSV）的故障进行有效测试,提出一种多音抖动测试方法。基于硅基板的TSV等效电路以及缺陷故障电路,将添加了高斯白噪声的多音信号作为测试激励,对TSV缺陷故障等效电路进行测试仿真,峰均比作为测试结果,判断故障情况。测试结果表明,该方法提高了对纳米结构微小故障测试的灵敏度,最小故障尺寸可达微米级。

英文摘要：

In order to effectively test the failure of the through silicon via,TSV equivalent circuit based on silicon substrate and defective fault circuit are established,and the multi-tone dither scheme is proposed.The multi-tone signal with Gaussian white noise is added as the test excitation and the equivalent circuit of TSV fault is tested and simulated.The peak-to-average ratio of test results to determine the size of the fault.The method improves the sensitivity of the small fault test in nanostructures,the high accuracy in fault recognition,the minimum size of the fault can be reached micron level.