中文摘要：

针对微电子元器件及其高密度系统制造，特别是大功率器件互连封装中无铅、低温互连而其接头又具有良好高温性能的需求，以作者课题组的研究为例，基于金属纳米颗粒具有高表面能的特性，简要概述其低温烧结连接用于电子封裴的原理、纳米颗粒膏的合成、低温烧结连接工艺因素对接头性能的影响及其发展趋势。

英文摘要：

With the development of microelectronie devices and high density nlicrosystems, especially large power device, inno- vative interennneetion materials and method for packaging or assembly to meet the requirements of lead-frce containing, good high temperature performance of joints while fabricated at low temperature, are needed. Based on the researt＇h results in anthor＇ s group, the contents and developing trend of the new sintering-bonding technology using nanoparlieles with high surface energy, including basic principle, interconnection material synthesis, effects of bonding parameters on the joint properties are briefly described.