中文摘要：

为研究热塑性聚酰亚胺（TPI)薄膜的力学性能，对其母材试件（M50)和两种不同焊接工艺的焊接薄膜试件（C50、T50)进行单轴拉伸试验。试验结果与分析表明：TPI薄膜母材M50的屈服强度约为40.1MPa,焊接膜材C50、T50的屈服强度分别为34.4MPa、39.6MPa。薄膜母材与焊接薄膜的抗拉强度及弹性模量基本一致。焊接温度影响TPI焊接膜材的屈服应力，不同焊接工艺对TPI焊接薄膜的抗拉强度及弹性模量无显著影响。

英文摘要：

To study the mechanical properties of the thermoplastic polyimides(TPI)films,uniaxial tensile tests were conducted in TPI base films(M50)and two different TPI welding films(C50and T50).The results showed that the yield stresses of M50,C50and T50were40.1MPa,34.4MPa and39.6MPa,respectively.The tensile strength and the elastic modulus of TPI base films and welding films were similar.The yield stress of TPI welding films was influenced by the welding tem-perature while the effects of welding technology on the tensile strength and the elastic modulus of TPI welding films were not significant.