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中文摘要：
3D NoC（Network—on—Chip）中，若连接层间相邻路由器的两组单向TSV（Through—Silicon Via）中有1组故障，数据便不能经该通道传输。为实现容错，提出一种在基于簇的3D NoC中添加冗余双向TSV的设计。任何1组单向TSV故障，都可通过配置这组双向TSV来替换，实现容错。在无故障TSV时，也可配置这组双向TSV来帮助传输数据包，实现数据的高速传输。与参考文献相比，实验表明，有TSV故障时该设计的平均延时至少减少了43．8％，且提高了系统可靠性。
英文摘要：
On the 3 D NoC （ Network-on-Chip）, if one of the two groups of unidirectional TSVs （ Through-Silicon Vias） in the adjacent routers between the layers has fault, the data would not be transmitted through this channel. A Fault-tolerant design of a cluster-based 3D NoC added redundant bidirectional TSVs is presented. A group of extra bidirectional TSVs, which could be dynamically configured between the unidirectional TSVs, was added to replace either of them which is faulted. What＇s more, in the trouble-free case, the bidirectional TSVs could be configured to help transmit data packets to achieve high-speed data transmission. The experimental results demonstrate that the average packet transmission latency decreases by 43.8% at lest compared with the reference when some TSVs are fault, and the reliability of the system is improved.
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