中文摘要：

用蒙特卡罗（MCNP）方法计算有机半导体的封装材料为金（Au）和陶瓷（Ceramic）、金属化层为金（Au）和铝（Al）时对金属一酞菁铜（CuPc）界面下剂量增强效应影响。结果表明，封装和金属化层结合方式不同，在界面下引起的剂量增强程度也不同，并讨论每种结构在界面下所产生的最大剂量增强系数及引起剂量增强的X射线的能量范围。

英文摘要：

Monte Carlo method is used to calculate dose enhancement effect at the metal-CuPc interface of organic semiconductor, with the package materials of gold and ceramic and the metal-lization layers of gold and aluminum. The results show that when the combination of packaging and metallization layers varies, the interface dose enhancement changes in different degrees. Fi-nally,the maximum dose enhancement factor of each structure at the interface and a dose-en-hanced X-ray energy range are discussed.