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Prediction of activities of all components in the lead-free solder systems Bi-In-Sn and Bi-In-Sn-Zn
  • ISSN号：0925-8388
  • 期刊名称：Journal of Alloys and Compounds
  • 时间：0
  • 页码：124-130
  • 语言：英文
  • 相关项目：熔渣的分子热力学模型及其应用研究
作者： Tao, Dong Ping|
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