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Dynamic recrystallization behavior during hot deformation and mechanical properties of 0.2 μm SiCp r
  • ISSN号：0921-5093
  • 期刊名称：Materials Science and Engineering A-Structural Mat
  • 时间：2013.1.10
  • 页码：824-830
  • 相关项目：双尺寸SiCp/AZ91镁基复合材料组织稳定性及高温变形行为研究
作者： Deng, K. K.|Wang, X. J.|Zheng, M. Y.|Wu, K.|
同期刊论文项目
双尺寸SiCp/AZ91镁基复合材料组织稳定性及高温变形行为研究
期刊论文 29
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