中文摘要：

在众多影响UV-LIGA（Ultra-violet lithography Galvanik abformung）技术制备微细金属零件尺寸精度的因素中，SU-8胶溶胀性是最主要的。通常采用隔离带方法降低SU-8胶的溶胀性，以提高电铸微细零件的尺寸精度。由于贵重金属会沉积到隔离带内，造成了贵重金属的浪费，增加制造成本，因此该方法不适合贵重金属微细零件制造。针对隔离带方法的弊端，提出了半隔离带方法，在保证电铸微细金属零件尺寸精度的前提下，避免了贵重金属的浪费。另外，还采用电解液喷射方法实现了高电流密度电铸，缩短了电铸时间，进一步提高了电铸微细金属零件的尺寸精度。试验结果表明：采用半隔离带方法和高电流密度，可以有效提高金微细零件的尺寸精度，当电流密度提高到0．6A／dm2，金微细零件的尺寸精度可以达到5μm。

英文摘要：

The swelling of SU-8 mold is one of the most important factors influencing the dimensional accuracy of a metal mieropart produced by ultra-violet lithography galvanik abformung（UV-LIGA）. The isolation belt struc- ture is usually employed to enhance the dimensional accuracy of electroformed metal mieropart. However, noble metal is wasted because the isolation belt is filled with metal when noble metal mieroparts are fabricated. There- fore, a semi-isolation belt structure is presented to save noble metal. Furthermore, a high current density is also introduced to shorten the eleetroforming time, and thus the dimensional accuracy of electroformed gold micropart is improved by using the electrolyte jet. The experimental results indicate that both the semi-isolation belt and the high current density can help to enhance the dimensional accuracy of electroformed gold micropart. Its dimen- sional error is only 5 μm at the current density of 0. 6 A/dm2 while the semi-isolation belt structure is used.