中文摘要：

为了在 solder 喷气在 solder 肿块形成上调查团结的影响，处理，液体(VOF ) 的卷侵犯到 fluxed 和流动得非的底层上的 solder 微滴当模特儿被介绍。高速度照相机被用来记录 solder 冲击并且检验模型的有效性。结果证明完全的反弹发生在侵犯到 fluxed 底层上的 solder 微滴的过程期间，而一锥形在侵犯到流动得非的底层上的 solder 微滴的过程期间焊接肿块形式。而且，在在最大值的椅背中间纵立的长条木板圆周和减小的提起起来的 solder 团结结果传播了因素。

英文摘要：

To investigate the influence of the solidification on the solder bump formation in the solder jet process, the volume of fluid （VOF） models of the solder droplets impinging onto the fluxed and non-fluxed substrates were presented. The high speed camera was used to record the solder impingement and examine the validity of the model. The results show that the complete rebound occurs during the process of the solder droplet impinging onto the fluxed substrate, whereas a cone-shaped solder bump forms during the process of the solder droplet impinging onto the non-fluxed substrate. Moreover, the solder solidification results in the lift-up of the splat periphery and the reduction in the maximum spread factor.