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中文摘要：
首先论述了投料策略对于半导体晶圆制造系统性能提升的重要性;随后将投料策略划分为常规投料策略、分产品分层控制投料策略、投料派工综合策略三类,并从这三个方面分别对投料策略进行了细致的归纳与具体的分析。最后,指出了投料策略未来的发展方向和存在的问题。
英文摘要：
This paper first states the important roles that release policies play in the process of improving the performance of semiconductor wafer fabrication system.Then,the release policies are divided into three categories,namely,normal release policies,release policies based on product/layerwise-control,and release-dispatch policies.And detail descriptions and analysis about these three categories are presented respectively.Finally,remaining problems and the future research focus of release policies are pointed out.
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