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Analysis of interfacial peeling in IC chip pick-up process
  • ISSN号：0021-8979
  • 期刊名称：Journal of Applied Physics
  • 时间：2011.10.1
  • 页码：-
  • 相关项目：柔性电子跨尺度喷印制造中动力学行为与多场调控
作者： Peng, Bo|Huang, YongAn|Yin, ZhouPing|Xiong, YouLun|
同期刊论文项目
柔性电子跨尺度喷印制造中动力学行为与多场调控
期刊论文 74 会议论文 24 专利 35 著作 1
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