中文摘要：

采用Cu46Zr46Al8非晶薄片作为连接中间层，在温度750-900℃、压力0．5MPa、保温时间300s条件下，对纯Cu进行瞬时液相扩散连接，采用扫描电镜（SEM）和能谱仪（EDS）对连接层组织和成分分布进行了分析，并对连接试样的力学性能进行了测试。结果表明，连接界面结合良好，当连接温度较低时（750-800℃），基体与连接界面层发生了扩散反应，形成了3层Cu-Zr金属间化合物反应层；当连接温度在850-900℃时，基体以胞状生长方式长人中间层，而中间层凝固成片层状共晶组织（Cu9Zr2和Cu）。900℃连接试样的抗拉强度为345MPa，表现出良好的塑性。

英文摘要：

Pure copper was joined by transient liquid-phase bonding process, using Cu46Zr46 AIs amorphous alloy foil as insert layer in the condition of 750-900 ℃, 0. 5 MPa and holding 300 s. Microstructure and composition distribution were analyzed by SEM and EDS, and mechanical properties of the joint under different bonding temperatures were tested. The results show that bond interface is good, and when bonding temperature is lower （750-800 ℃ ） , diffusion reaction occurs at the interface, leading to the formation of three Cu-Zr intermetallic compound layers. When bonding temperature is 850-900 ℃ , the Cu matrix grows into the interlayer in the cell-dendrite form, and a lamellar eutectic structure （ Cu9Zr2 and Cu） produces in the interlayer. Tensile strength of the joint bonded at 900 ℃ is 345 MPa, which exhibit good plasticity.