原位形变铜基复合材料是一类具有广阔应用前景的高性能功能材料。由于其具有良好的高强度、高导电率匹配关系,受到国内外的广泛研究。从不同最终形变工艺、热稳定性、强化机理及导电机理等方面对凝固/形变法制备原位形变铜基复合材料的国内外研究现状进行综述。并指出这类材料的发展趋势。
In situ deformed Cu-based composites are a kind of high performance functional materials with a great application potential. In situ Cu-based composites are widely researched for their high strength coupled with good electrical conductivity. The purpose of this paper is to review some recent research developments in the final deformation processing, thermal stability, strengthening and conducting mechanisms and to point out the developing tendency of these materials.