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Thermal-constrained task allocation for interconnect energy reduction in 3-D homogeneous MPSoCs
  • ISSN号：1063-8210
  • 期刊名称：IEEE Transactions on Very Large Scale Integration
  • 时间：2013
  • 页码：239-249
  • 相关项目：三维芯片中硅直通孔和晶片电路的测试技术研究
作者： Yuanqing Cheng|Lei Zhang|Yinhe Han*|Xiaowei Li|
同期刊论文项目
三维芯片中硅直通孔和晶片电路的测试技术研究
期刊论文 13 会议论文 13 专利 3
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