欢迎您！东篱公司
退出
-
申报数据库
-
立项数据库
-
成果数据库
-
项目获奖数据库
中文摘要：
为了解决芯片测试过程中功耗密度大造成的局部过热（简称＂热斑＂）问题,提出一种热量敏感的多播并行测试方法.对众核芯片采用多播并行测试时面临的＂热斑＂问题进行分析,提出一种无＂热斑＂的多播测试路径生成算法;在温度容限内对生成的多条单类同构芯核多播测试路径进行并行优化,形成无＂热斑＂的快速并行测试方案,同时缩短了测试时间.实验结果表明,采用文中方法能够有效地避免多播并行测试时的＂热斑＂,并使测试时间缩短近45%.
英文摘要：
The local overheating problem,which is referred to as hotspot,has become an important problem for parallel testing of many-core chips.This paper proposes a thermal-aware parallel multicast testing method to avoid hotspots.Firstly,we analyze the hotspots caused by parallel multicast test of many-core chips.Based on the above analysis,a heuristic algorithm is proposed to avoid hotspots during the generation of one multicast test access path.Finally,for further reducing the test time,we give an optimal solution of selecting candidate multicast test access paths which can coexist under the thermal constraints.Experimental results show that the hotspots can be eliminated,and the test time can be reduced by approximately 45 percent.
同期刊论文项目
同项目期刊论文
期刊信息
位置：