针对超薄金刚石切割片磨粒分布均匀性对加工质量影响很大且又不易评价的问题,提出了一种评价复合电沉积方法制造的超薄金刚石切割片中磨粒分布均匀性的方法,并结合0.01~0.05mm超薄金刚石切割片的研制,试验研究了复合电沉积工艺参数和搅拌方式对复合电沉积超薄金刚石切割片磨粒分布的影响规律。结果表明:在溶液金刚石浓度为15g/L,阴极电流密度为1A/dm2以及搅拌停歇时间比为1∶10的条件下,复合电沉积超薄金刚石切割片磨粒分布的均匀性能够得到有效改善。
A new method for evaluating the distribution of abrasive particles in co-electroplated ultra-thin diamond dicing tool was mentioned in this paper.The processing performance of diamond dicing tool mainly depends on the distribution of abrasive particles which is hard to be evaluated.Combined with the development of ultra-thin diamond dicing tool with a thickness of 0.01-0.05mm,the effects of co-electroplating parameters such as abrasive concentration in the solution,cathode current density and whisking method on the distribution of diamond particles in the dicing tool were studied.Experimental results show that the abrasive distribution can be improved effectively with the optimized co-electroplated parameters of 15g/L abrasive concentration in the solution,1A/dm~2 cathode current density and 1∶10 on-off ratio of whisking.