中文摘要：

阐述了LED封装材料对大功率LED散热和出光的影响及大功率LED的发展趋势。指出目前大功率LED研究的瓶颈是如何提高散热和出光以及封装互连材料在提高大功率LED散热和出光方面所具有的重要影响。讨论了芯片粘结材料、荧光粉、灌封胶、散热基板等。分析了导热胶、银浆和合金钎料、陶瓷基板、金属基板、复合基板,讨论了对出光影响比较大的灌封胶和荧光粉的选用,指出了未来的研究重点。

英文摘要：

An overall review of effects of packaging materials on the LED heat dissipation and light extraction was described and the development of new packaging and interconnection materials was reviewed. It is pointed out that the heat dissipation and light extraction are the bottlenecks to the development of the high brightness LED, the packaging and interconnection materials have great influences on the heat dissipation and light extraction efficiency. Die attach materials, phosphor, pouring sealant, heat dissipation substrate etc are discussed, and the thermal conductive adhesives, silver paste, solder, the metal substrate, ceramic substrate, and composite substrate are analyzed. The choice for pouring sealant and phosphors are discussed, which have big influence on the light extraction of LED. The further development focus is mentioned.