为解决LED散热问题,制作了一种一体化平板热管,搭建了平板热管实验台以研究此平板热管的传热性能,设计了模拟热源的保温方案。为了模拟LED芯片的发热,制作了模拟芯片热源,并对实验结果的不确定度进行分析。通过实验研究了加热功率、充液率和工质对平板热管传热性能的影响。实验结果表明:此平板热管具有良好的均温特性。在所测试的功率范围内,蒸发腔热阻随着功率的上升而降低。充液率方面,此平板热管的最佳充液率为40%。在测试的3种工质中,去离子水的传热效果最好。
In this paper, to solve the problem of LED heat dissipation, a integrated flat plate heat pipe was designed and the thermal performance was analyzed. An experimental rig was built to test the performance of the flat plate heat pipe. Project was designed to make sure the simulated heat source was insulated well. The simulated heater was fabricated to provide the heat flux which was needed in the experiment. By analyzing uncertainty of measurement, the results show that uncertainty of measurement is in the reasonable range. The influence of the heat power, filling ratio, and working fluid on the thermal performance of the flat plate heat pipe was studied. The experimental results show that the flat heat pipe has good temperature uniformity. The higher the power is, the lower the vapor chamber thermal resistance is. The optimal filling ratio of the flat heat pipe is 40% in the research. Among the three tested working fluids, the heat transfer performance of water proves to be the best.