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SEM in situ study on high cyclic fatigue of SnPb-solder joint in the electronic packaging
  • ISSN号：0026-2714
  • 期刊名称：Microelectronics Reliability
  • 时间：2011.8.8
  • 页码：1377-1384
  • 相关项目：MEMS焊点结构微观疲劳失效与可靠性的SEM原位研究
作者： Wang, Xi-Shu|Li, Xu-Dong|Ren, Huai-Hui|Zhao, Hai-Yan|Murai, Ryosuke|
同期刊论文项目
MEMS焊点结构微观疲劳失效与可靠性的SEM原位研究
期刊论文 11 会议论文 1
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