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Evolution of interfacial structures and creep behavior of Cu/Ta multilayers at room temperature
  • ISSN号：0921-5093
  • 期刊名称：Materials Science and Engineering A-Structural Mat
  • 时间：2015.10.14
  • 页码：163-168
  • 相关项目：电场辅助、沟槽引导一维金属纳米结构的自组装制备
作者： Shi J.|Pan G.J.|Xu L.J.|Meng X.K.|
同期刊论文项目
电场辅助、沟槽引导一维金属纳米结构的自组装制备
期刊论文 40
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