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Simulation research on stress of polymeric patterns during micro hot embossing
  • 期刊名称：Applied Mechanics and Materials
  • 时间：0
  • 页码：144-148
  • 相关项目：导电聚合物微构件的热压成型工艺及加工机理研究
作者： Ting Zhang|Yong He|Jianzhong Fu|
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导电聚合物微构件的热压成型工艺及加工机理研究
期刊论文 9 专利 6
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