中文摘要：

选用Ag-35.5Cu-1.8Ti和Ag-27.4Cu-4.4Ti两种钎料,在880℃/10min钎焊规范下进行了Cf/SiC陶瓷基复合材料的钎焊实验。实验结果表明,钎焊接头中央为典型的Ag-Cu共晶组织,而在钎料与Cf/SiC母材的界面处形成了扩散反应层,Ti在该层中富集。通过界面X射线衍射分析,确定界面存在TiC相,但未检测到Ti-Si相。分析了界面反应机理。接头强度试验结果表明,采用Ag-35.5Cu-1.8Ti钎料获得接头的三点弯曲强度为132.5MPa,而Ag-27.4Cu-4.4Ti对应的接头强度为159.5MPa,分析认为,Ti在钎料中的活性是决定接头性能的关键因素之一,即接头强度随着钎料中Ti活性的提高而呈现增加的趋势。

英文摘要：

The vacuum brazing of Cf/SiC ceramic matrix composite was studied with Ag-35.5Cu-1.8Ti and Ag-27.4Cu-4.4Ti brazing fillers at 880℃ for 10min and the sound joints were achieved.The SEM,XEDS and XRD analyzed results indicated that the reaction layers of two kinds of joints were visible in the brazing seams near the Cf/SiC matrix.Element Ti distributed at the reaction layers and reacted with C,forming TiC phase.Ti-Si phase was not detected in the reaction layers.The typical eutectic microstructure was formed in the central part of the joints.The room-temperature three-point bend strengths of the Cf/SiC joints brazed with Ag-35.5Cu-1.8Ti and Ag-27.4Cu-4.4Ti are 132.5 MPa and 159.5MPa respectively.The activity of Ti in the brazing fillers is the critical factor to the mechanical property of the joints,that is,the joints strength improves with the increase of the activity.