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中文摘要：
分析讨论了封装过程中质量的影响因素与机理，参数间的相互耦合、干扰问题，指出了其对合理设定工艺参数、提高质量和合格率的重要作用。对目前国内外引线键合研究进行较为深入地分析，为进一步研究封装过程多因素影响规律、动态建模和实时监控奠定了基础。
英文摘要：
The quality impact factors and mechanism of the packaging process, the coupling relationship between the parameters, and their disturbance were analyzed and discussed. The important role in reasonably setting parameters, improving quality and yields was pointed out. The researches on the wire bonding domestic and abroad were investigated, it lays a foundation for the further research on multi-impact-factor influenced quality issues, dynamic modeling and real-time monitoring.
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