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Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packa
  • ISSN号：0026-2714
  • 期刊名称：Microelectronics Reliability
  • 时间：2013.4.4
  • 页码：645-651
  • 相关项目：大功率半导体激光器芯片连接热循环和电脉冲疲劳失效机理
作者： Chen, Gang|Zhang, Ze-Sheng|Mei, Yun-Hui|Li, Xin|Lu, Guo-Quan|Chen, Xu|
同期刊论文项目
大功率半导体激光器芯片连接热循环和电脉冲疲劳失效机理
期刊论文 14 会议论文 5
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