A novel polishing technology for epoxy resin based on 355 nm UV laser
- ISSN号：1674-4926
- 期刊名称：《半导体学报：英文版》
- 时间：0
- 分类：TN[电子电信]
- 作者机构：[1]Institute of Microelectronics and Tsinghua National Laboratory for Information Science and Technology (TNList), Tsinghua University, Beijing 100084, China, [2]Shandong Senspil Electronic Technology Co., Ltd., Shandong 250107, China
- 相关基金：Project supported by the National Natural Science Foundation of China（Nos.61574083,61434001）; the National Basic Research Program（No.2015CB352100）; the National Key Project of Science and Technology（No.2011ZX02403-002）; the Special Fund for Agroscientic Research in the Public Interest of China（No 201303107）; the support of the Independent Research Program of Tsinghua University（No.2014Z01006）; Advanced Sensor and Integrated System Lab of Tsinghua University Graduate School at Shenzhen（No.ZDSYS20140509172959969）
中文摘要：
Corresponding author. Email： rentl@tsinghua.edu.cn
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