中文摘要：

基于自制的微力试验机和全场位移光学测量仪,建立了微尺度力学性能原位测试系统。其中微力试验机基于电磁驱动兼载荷计量原理设计,载荷量程和噪音分别为±1N和50μN。全场位移光学测量仪基于白光数字散斑相关方法研制。采用该系统对MEMS单晶硅（001）微悬臂梁进行了面内弯曲力学性能原位测试,获得了微悬臂梁末梢施力点的力-位移关系曲线,以及全场变形情况。结果显示,微悬臂梁表现出很好的弹性弯曲行为,最后在根部发生脆性断裂。根据弹性弯曲理论计算出单晶硅弹性模量为123.8GPa（±3.2%）。该技术为研究MEMS微构件的力学性能提供了一种有效的手段。

英文摘要：

An in-situ testing system for micro-scale mechanical performance was developed based on a homemade micro-force testing machine and an optical whole-field displacement measuring instrument.The microforce testing machine is designed based on principle of electromagnetic drive and load measurement with load range /noise of ± 1N /50μN,respectively.The optical whole-field displacement measuring instrument was developed based on white light digital speckle correlation method with the specimen’topography acted as the generalized speckle.In-plane bending performance test of MEMS monocrystalline silicon（001） microcantilevers was performed by using this testing system.The force-displacement curve at the end of microcantilever was acquired,as well as the whole-field displacement.Results show that the micro-cantilever presents a good elastic bending behavior and finally fractures at the root.Young’s modulus of monocrystalline silicon（001） is determined as 123.8GPa（± 3.2%） based on the elastic bending theory.This technique provides a feasible approach for studying the mechanical properties of MEMS micro-structures.