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中文摘要：
钨铜复合材料以高导热率,LED芯片热匹配等特性,成为LED散热基体的重点开发对象,而钨铜箔片轧制表面高平整性是首要前提,研究高效可行的微观整平方法意义深远。本文采用电解抛光的方法对钨铜箔片（W90Cu10）进行多次重复正交试验。以硫酸-磷酸系作为电解液,通过对抛光后箔片宏观表面质量评定、反射率测量及SEM微观表面形貌分析,初步确定了W90Cu10电解抛光的最佳工艺参数,分析了抛光液及工艺参数对抛光质量的影响及钨铜箔片电解抛光机理。实验表明：在硫酸与磷酸体积比2∶7、温度为45～55℃、抛光时间4～6 min、电流密度15～25 A/dm2条件下电解抛光试样表面相对反射率高达90%以上,表面呈镜面光亮。
英文摘要：
Tungsten-copper composite material was developed for high thermal conductivity,thermal expansion matching up with LED Chip.However,high smoothness for rolled surface of tungsten-copper foil was the precondition.It was important to find out a viable and efficient ways for improving foil micro-surface quality.Electro-polishing of tungsten-copper foil（W90Cu10） was studied in a sulfuric acid-phosphoric acid electrolyte by doing orthogonal experiments repeatedly.Through macro-surface quality evaluation,reflectivity measurements and SEM morphology analysis,W-Cu electro-polishing mechanism and effects of electrolyte composition and parameters on surface quality were analyzed.Experimental results show：under the conditions of volume ratio of sulfuric acid and phosphoric acid 2∶7,Temperature 45～55℃,polishing time 4～6 min,current intensity 15～25A/dm2,the relative reflectivity of electrolytic polishing surface is up to 90%,which is mirror bright.
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