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Experimental study of evaporation of sessile water droplet on PDMS surfaces
  • ISSN号:0567-7718
  • 期刊名称:《力学学报:英文版》
  • 时间:0
  • 分类:O634.41[理学—高分子化学;理学—化学] TG146.23[金属学及工艺—金属材料;一般工业技术—材料科学与工程;金属学及工艺—金属学]
  • 作者机构:[1]Department of Engineering Mechanics,School of Civil Engineering & Architecture,Hubei University of Technology, 430068 Wuhan, China, [2]State Key Laboratory of Nonlinear Mechanics,Institute of Mechanics, Chinese Academy of Sciences,100190 Beijing, China
  • 相关基金:supported by the National Natural Science Foundation of China(11002051,11072244,and 11372313);the Key Research Program of the Chinese Academy of Sciences(KJZDEW-M01);the Instrument Developing Project of the Chinese Academy of Sciences(Y2010031)
中文摘要:

polydimethylsiloxane (PDMS ) 上的无柄的水微滴的蒸发与三不同治好比率出现(5:1, 10:1,和 20:1 ) 试验性地在这份报纸被调查。我们证明有高治好比率的表面上的经常的接触半径(CCR ) 蒸发与低治好的比率比那长持续。我们也测量了由使用原子力量显微镜学(AFM ) 和 PDMS 电影的模仿的表面变丑的电影由无柄的水微滴导致了的 PDMS 的幼仔 moduli。与增加治好 PDMS 电影的比率, PDMS 电影的幼仔模量正在变得更低,然后将有更大的表面变丑,更多的橡皮存储精力。因为如此的精力充当一个障碍使三阶段的接触线卡住,因此,它将与更高治好比率在 PDMS 表面上导致更长的 CCR 蒸发。

英文摘要:

Evaporation of sessile water droplet on polydimethylsiloxane (PDMS) surfaces with three different curing ratios (5:1, 10:1, and 20:1) was experimentally investigated in this paper. We show that the constant contact radius (CCR) evaporation on surface with high curing ratio lasts longer than that with low curing ratio. We also measured Young's moduli of PDMS films by using atomic force microscopy (AFM) and simulated surface deformation of PDMS films induced by sessile water droplet. With increasing curing ratio of PDMS film, Young's modulus of PDMS film is getting lower, and then there will be larger surface deformation and more elastic stored energy. Since such energy acts as a barrier to keep the three-phase contact line pinned, thus it will result in longer CCR evaporation on PDMS surface with higher curing ratio.

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期刊信息
  • 《力学学报:英文版》
  • 中国科技核心期刊
  • 主管单位:中国科学技术协会
  • 主办单位:中国力学学会 中国科学院力学研究所
  • 主编:卢天健
  • 地址:北京市海淀区北四环西路15号
  • 邮编:100190
  • 邮箱:actams@cstam.org.cn
  • 电话:010-62536271
  • 国际标准刊号:ISSN:0567-7718
  • 国内统一刊号:ISSN:11-2063/O3
  • 邮发代号:2-703
  • 获奖情况:
  • 国内外数据库收录:
  • 被引量:352