目前微电子与光电子芯片对散热要求日益增高,烧结式微热管已经成为其理想的散热元件,对微热管进行快速抽真空,使微热管中的工质量与真空度符合要求,是决定其制造质量与成本的重要因素。通过对微热管的工作原理及其抽真空-工质灌注-冷焊的制造方法进行分析,提出一种分别采用工质冻结-抽真空-冷焊法与二次除气-冷焊法对烧结式微热管进行抽真空的方法。大量的实验表明,采用所提出的制造方法不仅可以保证微热管中工质量与真空度达到要求,而且抽真空的时间大约比原有方法节省了2/3,具有很好的传热性能。
A novel technique has been successfully developed to fabricate the micro heat pipe with sintered wick,recently widely used as highly efficient heat-sink in manufacturing microelectronic and optoelectronic chips.In the technique,the injected working fluid was first frozen;next,degassing was done by rapidly pumping the pressure down to below 110 Pa;and finally,the micro heat pipe was crimping sealed,followed by secondary degassing and crimping sealing.The field tests on industrial scale show that the micro heat pipe with sintered wick fabricated with the newly-developed technique outperforms that produced in the conventional method.For example,the pumping time is reduced by 2/3,and its thermal conductivity and quantity of the working fluid better satisfy the stringent requirements.