中文摘要：

利用三维电磁仿真软件HFSS研究了基片减薄结构对微带薄膜环行器性能的影响。提出了一种减薄非磁性介质基片的结构：首先将基片进行减薄处理,再与具有孔洞的硅基片结合,组合成复合基片。研究了复合基片结构对薄膜环行器S参数的影响。研究结果显示这种基片处理过的环行器能显著改善环行器的性能,尤其在器件的工作带宽方面,从原有的435 MHz提高到745 MHz。这为制备出宽带薄膜环行器取代块材环行器,为器件的小型化、轻量化、集成化提供一定的参考。

英文摘要：

3D electromagnetic simulation software HFSS was used to study the effect of substrate thinning structure on the performance of microstrip thin film circulator. A structure of thinning non magnetic dielectric composite substrate was put forward. First, the substrate of thin-film circulator was thinned, then combined with the Si substrate having a hole, then assembled into composite substrate. After that, the influences of composite substrate structure on the S parameters of thin film circulator were studied. The results of the study show that the composite substrate can significantly improve the performance of the circulator. Especially the working bandwidth of the circulator is raised from the original 435 MHz to 745 MHz. The film circulator can replace bulk circulator, that supplies references for miniaturization, lightweight and integration of the microwave devices.